Volume XVI, Issue 42 | November 7, 2016 Dear %%FirstName%%, There are pros and cons to many of the specifications found on wide format devices. […]
11.21.16 Canon U.S.A., Inc., a leader in digital imaging solutions...
11.21.16 Dscoop, an independent community of HP...
11.18.16 UK software developer, Taopix, has released the latest version...
11.18.16 GMC Software Technology (GMC), the award-winning leader...
11.16.16 GPA, the market leader in substrate solutions for digital...
Roland DGA has launched some exciting...
11.16.16 Wheaton IL. Aleyant, an innovative leader in providing robust...
Toshiba America Business Solutions today announced...
11.16.16 AEG and Toshiba are strengthening ties with a new...
11.14.16 WebCenter 16, Eskos Packaging Management Solution...
07.08.2026 Konica Minolta Business Solutions U.S.A., Inc. today announced...
07.07.2026 Enfocus, the leader in affordable, flexible automation ...
07.06.2026 Tecnau announces the successful installation, testing...
06.30.2026 Loftware, a global leader in product identification and supply ...
06.30.2026 DigiCut is proud to announce the release of DigiCut 3.0...
Direct to film (DTF) and direct to garment (DTG) printing solutions are leveraged by wide format print shops as a way...
Smaller format flatbeds, which for the purpose of this article ...
Each year, a community of HP Industrial Print and Large Format owners and users gather for the annual Dscoop conference.
Integrated technologies are increasingly adopted to support humidification in digital corrugated printing environments.
With advancing technologies in digital print and finishing, print providers and mailers may consider taking...